Bosch Sensortec has developed a compact triaxial magnetic field sensor measuring the terrestrial magnetic field. The BMM150 is implemented in Wafer Level Chip Scale Package (WLCSP), resulting in an extremely small footprint of only 1.56 mm x 1.56 mm and a height of just 0.6 mm.

The utilization of Bosch's innovative FlipCore measurement technology provides superior properties with respect to power consumption and measurement range.


The sensors



The BMM150 is a low power and low noise 3-axis digital geomagnetic sensor for compass applications. The 12-pin wafer level chip scale package (WLCSP) with a footprint of 1.56 x 1.56 mm² and 0.60 mm height is ideal for Augmented Reality applications and location-based services.