Pressure Sensor BMP384
BMP384 has a gel-filled cavity that allows higher robustness against water, liquids and other chemicals if the applicable integration concept is used. The BMP384 with its small footprint offers outstanding design flexibility, providing a single package solution that is easy to integrate into other existing and upcoming devices for smart homes, industrial products and wearables.
- Robustness
- Small size
- Excellent performance
| Order | |||
|---|---|---|---|
|
Out of Stock | 0 pieces | Not available |
|
Out of Stock | 0 pieces | Not available |
|
Out of Stock | 0 pieces | Not available |
|
Out of Stock | 0 pieces | Not available |
|
Out of Stock | 0 pieces | Not available |
Technical data
Package dimensions
2.0 x 2.0 x 1.0 mm³ metal lid LGA
Operation range
Pressure: 300... 1250 hPa
Supply voltage VDDIO
Supply voltage VDD
Supply voltage VDD
1.2 V ... 3.6 V
1.65 V ... 3.6 V
1.65 V ... 3.6 V
Interface
I²C (up to 3.4 MHz) and SPI (3 and 4 wire, up to 10 MHz)
Average typical current consumption (1 Hz data rate)
3.4 µA @ 1 Hzpressure and temperature,
2.0 µA in sleep mode
2.0 µA in sleep mode
Absolute accuracy
P=300 ...1100 hPa (T=0 ... 65 °C)
P=300 ...1100 hPa (T=0 ... 65 °C)
± 50 Pa
Relative accuracy pressure (typ.) P=900…1100 hPa (T=25 … 40°C)
± 9 Pa, equiv. to ± 0.75 m
Noise in pressure (lowest bandwidth, highest resolution)
0.03 Pa
Temperature coefficient offset (25°…40°C @ 900 hPa)
±1 Pa/K
Long-term stability (12 months)
±0.70 hPa
Solder drift
< ± 1.75 hPa
Maximum sampling rate
200 Hz
