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Bosch Sensortec
Industry-leading low noise. Precise time sync. Minimal latency.

Inertial Measurement Unit: BMI560

Engineered for high-end XR headsets & glasses, smartphones and action cams, the BMI560 delivers high-performance where precision, stability, and responsiveness are non-negotiable. The BMI560 sets a new benchmark in motion sensing, capturing every nuance with ultra-low noise.


It enables seamless sensor fusion and minimal motion-to-photon latency for truly immersive AR/VR experiences and flawless optical image stabilization. Real-time responsiveness ensures immediate data for XR systems, making every interaction smooth and natural. Key use cases include immersive XR/MR vision, intuitive 3D gesture control, and ultra-stable imaging in action cams and flagship smartphones.


A programmable Edge-AI classification engine supports always-on functionality by analyzing motion patterns directly on the sensor, reducing system power consumption and accelerating customer-specific use cases.

  • Industry-leading low noise: 50µg/√Hz & < 3 mdps/√Hz
  • Precise time synchronization: 1 ns resolution
  • Minimal latency: below 0.5 ms


If you are interested in BMI560, please use our contact form.

Samples are now available for direct customers. The complete product line is planned to enter high-volume production from Q3 2026 onwards.

The platform for limitless innovation

The BMI5 family is designed to make premium devices smarter, more precise, and incredibly intuitive. Built on a common, high-performance hardware foundation, the platform adapts effortlessly across applications through intelligent software. Simply put, the U in IMU stands for “Ultra”.

AR/VR/MR vision

3D interaction/gesture control

High-end OIS/EIS

Technical data

Package dimensions
2.5 x 3.0 x 0.75 mm³ LGA
Digital resolution
Accelerometer (A): 16 & 24-bit
Gyroscope (G): 16 & 24-bit
Measurement ranges
(A): ±2, ±4, ±8, ±16, ±32 g
(G): ±125, ±250, ±500, ±1000,
±2000, ±4000 °/s
Output data rates (selectable)
(A): 1.56 Hz ... 6.4 kHz
(G): 12.5 Hz … 12.8 kHz
Offset (soldered on PCB)
(A): ± 10 mg
(G): ± 0.5 °/s
Offset drift vs. temperature (TCO)
(A): ± 0.07 mg/K
(G): ± 0.003 °/s/K
Sensitivity error (soldered on PCB)
(A): 0.1%
(G): 0.3%
Noise density (typ.)
(A): < 50 µg/√Hz (≤8g)
< 60 µg/√Hz (16g)
(G): < 0.003 °/s /√Hz
Current consumption
(A+G combo @ max. ODR)
650 µA for typ. operation
Current consumption
(A+G combo @ 100 Hz ODR)
250 µA for low-power operation
Current consumption
(A+G combo @ suspend mode)
3 µA for suspend operation
Interface
primary MIPI I³C®, I²C, SPI
2 Interrupt Pins (I²C, I³C)
1 Interrupt Pin (3-wire SPI)
secondary AUX I²C controller
secondary OIS MIPI I³C®, I²C, SPI
Power modes
High performance-, normal-,
several low power-, standby- and
suspend mode
FIFO
8 KB on-chip FIFO data buffer
Temperature range
-40 … +85 °C
Supply voltage
VDD range 1.71 ... 3.6 V
VDDIO range 1.08 ... 3.6 V

Documents

BST-BMI560-FL000

Flyer

BST-BMI560-FL000

Download

Applications and solutions

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