Technical data
Package dimensions
2.5 x 3.0 x 0.75 mm³ LGA
Digital resolution
Accelerometer (A): 16 & 24-bit
Gyroscope (G): 16 & 24-bit
Gyroscope (G): 16 & 24-bit
Measurement ranges
(A): ±2, ±4, ±8, ±16, ±32 g
(G): ±125, ±250, ±500, ±1000,
±2000, ±4000 °/s
(G): ±125, ±250, ±500, ±1000,
±2000, ±4000 °/s
Output data rates (selectable)
(A): 1.56 Hz ... 6.4 kHz
(G): 12.5 Hz … 12.8 kHz
(G): 12.5 Hz … 12.8 kHz
Offset (soldered on PCB)
(A): ± 10 mg
(G): ± 0.5 °/s
(G): ± 0.5 °/s
Offset drift vs. temperature (TCO)
(A): ± 0.07 mg/K
(G): ± 0.003 °/s/K
(G): ± 0.003 °/s/K
Sensitivity error (soldered on PCB)
(A): 0.1%
(G): 0.3%
(G): 0.3%
Noise density (typ.)
(A): < 50 µg/√Hz (≤8g)
< 60 µg/√Hz (16g)
(G): < 0.003 °/s /√Hz
< 60 µg/√Hz (16g)
(G): < 0.003 °/s /√Hz
Current consumption
(A+G combo @ max. ODR)
(A+G combo @ max. ODR)
650 µA for typ. operation
Current consumption
(A+G combo @ 100 Hz ODR)
(A+G combo @ 100 Hz ODR)
250 µA for low-power operation
Current consumption
(A+G combo @ suspend mode)
(A+G combo @ suspend mode)
3 µA for suspend operation
Interface
primary MIPI I³C®, I²C, SPI
2 Interrupt Pins (I²C, I³C)
1 Interrupt Pin (3-wire SPI)
secondary AUX I²C controller
secondary OIS MIPI I³C®, I²C, SPI
2 Interrupt Pins (I²C, I³C)
1 Interrupt Pin (3-wire SPI)
secondary AUX I²C controller
secondary OIS MIPI I³C®, I²C, SPI
Power modes
High performance-, normal-,
several low power-, standby- and
suspend mode
several low power-, standby- and
suspend mode
FIFO
8 KB on-chip FIFO data buffer
Temperature range
-40 … +85 °C
Supply voltage
VDD range 1.71 ... 3.6 V
VDDIO range 1.08 ... 3.6 V
VDDIO range 1.08 ... 3.6 V
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