Technical data
Package dimensions
1.28 x 1.28 x 0.5 mm³ wafer level chip scale package (WLCSP)
Operating range
-40 °C to 85 °C
Supply voltage
VDDIO: 1.72 V … 3.6 V
VDD: 1.72 V … 1.98 V
VDD: 1.72 V … 1.98 V
Typical output noise rms
3dB BW = ODR/2
3dB BW = ODR/2
± 190 nTrms (x,y axis) and
± 450 nT rms (z axis)
± 450 nT rms (z axis)
Sensitivity Temperature Drift (typ.)
± -0.010 %/K
Average typical current consumption
200 µA @ 100 Hz in normal mode
Magnetic field range, all axes
± 2000 µT
Zero-field offset drift after soldering (typ.)
± 25 µT
Sensitivity/gain error after soldering (typ.)
± 1 %
Interface
I2C and I3C
TCO error (typ.)
± 200 nT/K
Maximum sampling rate
400 Hz (normal mode)