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BMA530 & BMA580 - A new dimension of acceleration
Technical data
Package dimensions (typ.)
1.2 x 0.8 x 0.55 mm³
Wafer level chip scale package
Wafer level chip scale package
Digital Resolution
16 bit
Measurement ranges
±2, ±4, ±8, ±16 g
Output data rate
~1.56 Hz … 6.4 kHz
Offset soldered, over life
±75 mg
TCO
±0.75 mg/K
Sensitivity Error
1%
Noise density
120 µg/√Hz
Current consumption (high perf, continuous measurement)
125 µA
Current consumption (low power@ 100 Hz)
18 µA
Current consumption (suspend mode, data retention)
4.75 µA
Interface
I³C, I²C and SPI
2 Interrupt Pins (I²C, I³C)
1 Interrupt Pin (3-wire SPI)
2 Interrupt Pins (I²C, I³C)
1 Interrupt Pin (3-wire SPI)
Power modes
High perf. mode, Low power mode (LPM)
FIFO
1 KB (incl. FIFO full, FIFO watermark interrupt)
Interrupts
Data Ready interrupt
3 generic interrupts, incl. Any-/No-motion
Step Counter
Android Features
3 generic interrupts, incl. Any-/No-motion
Step Counter
Android Features