Bosch Sensortec is partnering with established and emerging software and system companies around the world. Highlighting 4 of those projects: Arduino, Atmel, Hillcrest and NXP. For a full list of Bosch Sensortec partners, please go here.
The Arduino 9 Axes Motion Shield is based on the Bosch Sensortec BNO055 absolute orientation sensor.
The partnership between Arduino and Bosch Sensortec was born with the design of the 9 Axes Motion Arduino Shield. The strong cooperation established gave rise to a new product called Arduino that allows our users to have a platform ready for using Bosch sensor in the IoT world for developing new applications. This promotion will generate new business opportunities for both companies.
Arduino is an open-source tool used for building electronics projects. It consists of a physical programmable circuit board (often referred to as a micro-controller) and a development environment, or IDE (Integrated Development Environment) that runs on your computer, which is used to write and upload computer code to the board.
The BNO055 Xplained Pro Extension utilizes the Bosch BNO055 Intelligent 9-axis absolute orientation sensor and a RGB LED. It connects to the extension headers of any Xplained Pro board.
"As a leading provider of secure, smart and connected solutions, we are committed to providing the essential tools and platforms to bring more IoT and wearable designs to market", said Steve Pancoast, Vice President of Development Tools and Software, Atmel Corporation. "The new extension board enhances our Xplained platform and allows designers to bring a truly captivating experience to next-generation wearables and IoT applications. We are excited to team with Bosch on this new extension board".
Atmel Corporation is a worldwide leader in the design and manufacture of microcontrollers, capacitive touch solutions, advanced logic, mixed-signal, nonvolatile memory and radio frequency (RF) components.
„The SmartBond™ IoT Sensor Development Kit makes developing motion and environmental sensing applications easy. Merging cutting-edge Bluetooth® Smart hardware, sensors and sensor fusion software, it enables the world’s lowest power 12 Degrees-of-Freedom (DoF) wireless sensor module. Highly integrated, it cuts system size and cost and includes all essential hardware and software to speed creation of advanced IoT devices.
This complete development platform developed by Dialog on the basis of Bosch Sensortec sensors, combines Bluetooth wireless communications and an ARM Cortex-M0 processor with an accelerometer, gyroscope, magnetometer and environmental sensors. All this on a board measuring just 16 x 15 mm.
It also includes SmartFusion™, Dialog’s unique smart sensor fusion software library for data acquisition, sensor calibration and fusion. Ideal for resource-constrained systems, it minimizes memory, processing requirements and power consumption.”
Bosch Sensortec and Hillcrest Labs have introduced a new sensor solution for head-mounted displays (HMDs). The new BNO070 solution includes Hillcrest’s SH-1 software, optimized for HMD applications, running on Bosch Sensortec’s 9-axis system in package (SiP), which features an accelerometer, gyroscope, magnetometer and a 32-bit microcontroller in a single package.
“Applications enabled by sensors will become essential to a wide variety of consumer and industrial products”, agrees Dan Simpkins, CEO of Hillcrest Labs. “This collaboration with Bosch Sensortec enables us to offer complete, scalable and high performance solutions to emerging markets such as HMDs and the next generation of wearable devices”.
Hillcrest Labs is the leading global supplier of software and hardware for sensor-enabled products. Our Freespace® technology transforms sensor data into high quality, contextual information.
The LPC54102 Sensor Processing/Motion Solution has been developed by NXP and its partners to provide all that you need to develop an always-on sensor processing product. The Solution combines an LPCXpresso54102 board and a Sensor Shield Board (SSB), plus application software and sensor fusion software from Bosch Sensortec to provide a highly capable platform for always-on sensor processing. The Sensor Shield Board contains the following Bosch Sensortec sensors: BMI055 inertial measurement unit BMC150 digital compass, BMM150 magnetometer and BMP280 pressure/temperature sensor.
NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets.
The EOS™ S3 Sensor Processing SoC Reference Design from QuickLogic includes the EOS S3 sensor processing SoC, the Bosch BMI160, an integrated microphone and variety of other sensors. The reference design enables OEMs to efficiently develop high-performance smartphone, wearable and IoT systems using the Bosch BMI160 motion sensors. Data from these and other sensors is fused and processed by the EOS S3 sensor processing SoC. The platform connects directly to the Google Nexus 5 smartphone through an integrated micro-USB connection port. The system is also supported by QuickLogic’s Celeris Integrated Development Environment (IDE) Tool Suite and Eclipse plug-in software development environment with ARM® M4F support, as well as IAR Embedded Workbench.
“The EOS S3 SoC is the lowest power programmable sensor processing reference design available, and when paired with high-accuracy Bosch sensors, delivers substantially lower power consumption for mobile and IoT designs,” said Brian Faith, VP of Worldwide Marketing at QuickLogic.